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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. lm2902lv , LM2904LV sbos960 ? september 2018 lm290xlv industry standard, low voltage operational amplifiers 1 1 features 1 ? industry standard amplifier for cost-sensitive systems ? low input offset voltage: 1 mv ? common-mode voltage range includes ground ? unity-gain bandwidth: 1 mhz ? low broadband noise: 40 nv/ hz ? low quiescent current: 90 a/ch ? unity-gain stable ? operational at supply voltages from 2.7 v to 5.5 v ? offered in dual- and quad-channel variants ? robust esd specification: 2-kv hbm ? extended temperature range: ? 40 c to 125 c 2 applications ? cordless appliances ? uninterruptible power supply ? battery pack, charger, and test equipment ? power supply modules ? environmental sensors signal conditioning ? field transmitter: temperature sensors ? oscilloscopes, digital multimeters, and signal analyzers ? rack mount server ? hvac: heating, ventilating, and air conditioning ? dc motor control ? low-side current sensing 3 description the lm290xlv family includes the dual LM2904LV and quad lm2902lv operational amplifiers, or op amps. the devices operate from a low voltage of 2.7 v to 5.5 v. these op amps supply an alternative to the lm2904 and lm2902 in low-voltage applications that are sensitive to cost. some applications are large appliances, smoke detectors, and personal electronics. the lm290xlv devices supply better performance than the lm290x devices at low voltage, and have lower power consumption. the op amps are stable at unity gain, and do not have reverse phase in overdrive conditions. the design for esd gives the lm290xlv family an hbm specification for a minimum of 2 kv. the lm290xlv family is available in packages that have industry standards. the packages include soic, vssop, and tssop packages. device information (1) part number package body size (nom) lm2902lv soic (14) 8.65 mm 3.91 mm tssop (14) 4.40 mm 5.00 mm LM2904LV soic (8) 3.91 mm 4.90 mm tssop (8) 3.00 mm x 4.40 mm vssop (8) 3.00 mm 3.00 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. single-pole, low-pass filter productfolder r g r f r 1 c 1 v in v out = 1 + v v out in r r f g 1 1 + sr c 1 1 ( ( ( ( 1 2 p r c 1 1 f = - 3 db support &community tools & software technical documents ordernow
2 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 5 6.1 absolute maximum ratings ...................................... 5 6.2 esd ratings .............................................................. 5 6.3 recommended operating conditions ....................... 5 6.4 thermal information: LM2904LV .............................. 6 6.5 thermal information: lm2902lv .............................. 7 6.6 electrical characteristics ........................................... 8 6.7 typical characteristics .............................................. 9 7 detailed description ............................................ 14 7.1 overview ................................................................. 14 7.2 functional block diagram ....................................... 14 7.3 feature description ................................................. 14 7.4 device functional modes ........................................ 15 8 application and implementation ........................ 16 8.1 application information ............................................ 16 8.2 typical application .................................................. 16 9 power supply recommendations ...................... 18 9.1 input and esd protection ....................................... 18 10 layout ................................................................... 19 10.1 layout guidelines ................................................. 19 10.2 layout example .................................................... 19 11 device and documentation support ................. 21 11.1 documentation support ........................................ 21 11.2 related links ........................................................ 21 11.3 receiving notification of documentation updates 21 11.4 community resources .......................................... 21 11.5 trademarks ........................................................... 21 11.6 electrostatic discharge caution ............................ 21 11.7 glossary ................................................................ 21 12 mechanical, packaging, and orderable information ........................................................... 21 4 revision history date revision note september 2018 * initial release
3 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 5 pin configuration and functions LM2904LV d, dgk, pw packages 8-pin soic, vssop, tssop top view pin functions: LM2904LV pin i/o description name no. in1 ? 2 i inverting input, channel 1 in1+ 3 i noninverting input, channel 1 in2 ? 6 i inverting input, channel 2 in2+ 5 i noninverting input, channel 2 out1 1 o output, channel 1 out2 7 o output, channel 2 v ? 4 i or ? negative (low) supply or ground (for single-supply operation) v+ 8 i positive (high) supply 1 out1 8 v+ 2 in1 7 out2 3 in1+ 6 in2 4 v 5 in2+ not to scale
4 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated lm2902lv d, pw packages 14-pin soic, tssop top view pin functions: lm2902lv pin i/o description name no. in1 ? 2 i inverting input, channel 1 in1+ 3 i noninverting input, channel 1 in2 ? 6 i inverting input, channel 2 in2+ 5 i noninverting input, channel 2 in3 ? 9 i inverting input, channel 3 in3+ 10 i noninverting input, channel 3 in4 ? 13 i inverting input, channel 4 in4+ 12 i noninverting input, channel 4 out1 1 o output, channel 1 out2 7 o output, channel 2 out3 8 o output, channel 3 out4 14 o output, channel 4 v ? 11 i or ? negative (low) supply or ground (for single-supply operation) v+ 4 i positive (high) supply 1 out1 14 out4 2 in1 13 in4 3 in1+ 12 in4+ 4 v+ 11 v 5 in2+ 10 in3+ 6 in2 9 in3 7 out2 8 out3 not to scale
5 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) input pins are diode-clamped to the power-supply rails. input signals that may swing more than 0.5 v beyond the supply rails must be current limited to 10 ma or less. (3) short-circuit to ground, one amplifier per package. 6 specifications 6.1 absolute maximum ratings over operating junction temperature range (unless otherwise noted) (1) min max unit supply voltage, ([v+] ? [v ? ]) 0 6 v signal input pins voltage (2) common-mode (v ? ) ? 0.5 (v+) + 0.5 v differential (v+) ? (v ? ) + 0.2 v current (2) ? 10 10 ma output short-circuit (3) continuous operating, t a ? 55 125 c operating junction temperature, t j 150 c storage temperature, t stg ? 65 150 c (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per ansi/esda/jedec js-001 (1) 2000 v charged-device model (cdm), per jedec specification jesd22-c101 (2) 1000 6.3 recommended operating conditions over operating junction temperature range (unless otherwise noted) min max unit v s supply voltage [(v+) ? (v ? )] 2.7 5.5 v v in input-pin voltage range (v ? ) ? 0.1 (v+) ? 1 v t a specified temperature ? 40 125 c
6 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated (1) for more information about traditional and new thermal metrics, see semiconductor and ic package thermal metrics . 6.4 thermal information: LM2904LV thermal metric (1) LM2904LV unit d (soic) dgk (vssop) pw (tssop) 8 pins 8 pins 8 pins r ja junction-to-ambient thermal resistance 207.9 201.2 200.7 c/w r jc(top) junction-to-case (top) thermal resistance 92.8 85.7 95.4 c/w r jb junction-to-board thermal resistance 129.7 122.9 128.6 c/w jt junction-to-top characterization parameter 26 21.2 27.2 c/w jb junction-to-board characterization parameter 127.9 121.4 127.2 c/w
7 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated (1) for more information about traditional and new thermal metrics, see semiconductor and ic package thermal metrics . 6.5 thermal information: lm2902lv thermal metric (1) lm2902lv unit d (soic) pw (tssop) 14 pins 14 pins r ja junction-to-ambient thermal resistance 102.1 148.3 c/w r jc(top) junction-to-case (top) thermal resistance 56.8 68.1 c/w r jb junction-to-board thermal resistance 58.5 92.7 c/w jt junction-to-top characterization parameter 20.5 16.9 c/w jb junction-to-board characterization parameter 58.1 91.8 c/w
8 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 6.6 electrical characteristics for v s = (v+) ? (v ? ) = 2.7 v to 5.5 v ( 1.35 v to 2.75 v), t a = 25 c, r l = 10 k ? connected to v s / 2, and v cm = v out = v s / 2 (unless otherwise noted) parameter test conditions min typ max unit offset voltage v os input offset voltage v s = 5 v 1 3 mv v s = 5 v, t a = ? 40 c to 125 c 5 dv os /dt v os vs temperature t a = ? 40 c to 125 c 4 v/ c psrr power-supply rejection ratio v s = 2.7 v to 5.5 v, v cm = (v ? ) 80 100 db input voltage range v cm common-mode voltage range no phase reversal (v ? ) ? 0.1 (v+) ? 1 v cmrr common-mode rejection ratio v s = 2.7 v, (v ? ) ? 0.1 v < v cm < (v+) ? 1 v t a = ? 40 c to 125 c 84 db v s = 5.5 v, (v ? ) ? 0.1 v < v cm < (v+) ? 1 v t a = ? 40 c to 125 c 63 92 input bias current i b input bias current v s = 5 v 15 pa i os input offset current 5 pa noise e n input voltage noise (peak-to- peak) ? = 0.1 hz to 10 hz, v s = 5 v 5.1 v pp e n input voltage noise density ? = 1 khz, v s = 5 v 40 nv/ hz input capacitance c id differential 2 pf c ic common-mode 5.5 pf open-loop gain a ol open-loop voltage gain v s = 2.7 v, (v ? ) + 0.15 v < v o < (v+) ? 0.15 v, r l = 2 k 110 db v s = 5.5 v, (v ? ) + 0.15 v < v o < (v+) ? 0.15 v, r l = 2 k 125 frequency response gbw gain-bandwidth product v s = 5 v 1 mhz m phase margin v s = 5.5 v, g = 1 75 sr slew rate v s = 5 v 1.5 v/ s t s settling time to 0.1%, v s = 5 v, 2-v step , g = 1, c l = 100 pf 4 s to 0.01%, v s = 5 v, 2-v step , g = 1, c l = 100 pf 5 t or overload recovery time v s = 5 v, v in gain > v s 1 s thd+n total harmonic distortion + noise v s = 5.5 v, v cm = 2.5 v, v o = 1 v rms , g = 1, f = 1 khz, 80 khz measurement bw 0.005% output v oh voltage output swing from positive supply r l 2 k , t a = ? 40 c to 125 c 1 v v ol voltage output swing from negative supply r l 10 k , t a = ? 40 c to 125 c 40 75 mv i sc short-circuit current v s = 5.5 v 40 ma z o open-loop output impedance v s = 5 v, f = 1 mhz 1200 power supply v s specified voltage range 2.7 ( 1.35) 5.5 ( 2.75) v i q quiescent current per amplifier i o = 0 ma, v s = 5.5 v 90 150 a i o = 0 ma, v s = 5.5 v, t a = ? 40 c to 125 c 160
9 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 6.7 typical characteristics at t a = 25 c, v+ = 2.75 v, v ? = ? 2.75 v, r l = 10 k connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) figure 1. i b and i os vs common-mode voltage figure 2. open-loop gain vs temperature c l = 10 pf figure 3. open-loop gain and phase vs frequency figure 4. open-loop gain vs output voltage c l = 10 pf figure 5. closed-loop gain vs frequency temperature ( q c) gain (db) -40 -20 0 20 40 60 80 100 120 140 0 20 40 60 80 100 120 140 160 d008 v s = 5.5 v v s = 2.5 v output voltage (v) open-loop voltage gain (db) -3 -2 -1 0 1 2 3 0 20 40 60 80 100 120 140 160 d010d010d010d010 common-mode voltage (v) i b and i os (pa) -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 -10 -8 -6 -4 -2 0 2 4 6 8 10 d007 ib- ib+ ios frequency (hz) gain (db) phase ( q ) -20 0 0 20 20 40 40 60 60 80 80 100 100 120 1k 10k 100k 1m d009 gain phase frequency (hz) gain (db) -20 -10 0 10 20 30 40 50 60 70 80 100 1k 10k 100k 1m d011 gain = 1 gain = 1 gain = 10 gain = 100 gain = 1000
10 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v+ = 2.75 v, v ? = ? 2.75 v, r l = 10 k connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) figure 6. output voltage vs output current (claw) figure 7. psrr vs frequency v s = 2.7 v to 5.5 v figure 8. dc psrr vs temperature figure 9. cmrr vs frequency v cm = (v ? ) ? 0.1 v to (v+) ? 1.5 v figure 10. dc cmrr vs temperature figure 11. 0.1 hz to 10 hz integrated voltage noise time (1 s/div) amplitude (1 p v/div) d017 frequency (hz) common-mode rejection ratio (db) 0 20 40 60 80 100 120 100 1k 10k 100k 1m d015 temperature ( q c) common-mode rejection ratio (db) -40 -20 0 20 40 60 80 100 120 140 0 20 40 60 80 100 120 d016 v s = 2.7 v v s = 5.5 v frequency (hz) power supply rejection ratio (db) 0 20 40 60 80 100 120 100 1k 10k 100k 1m d013 psrr+ psrr output current (ma) output voltage (v) 0 5 10 15 20 25 30 35 40 45 50 -3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 d012d012 -40 q c 25 q c 85 q c 125 q c temperature ( q c) power supply rejection ratio (db) -40 -20 0 20 40 60 80 100 120 140 0 20 40 60 80 100 120 d014
11 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v+ = 2.75 v, v ? = ? 2.75 v, r l = 10 k connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) figure 12. input voltage noise spectral density v s = 5.5 v, v cm = 2.5 v, g = 1, bw = 80 khz, v out = 0.5 v rms figure 13. thd + n vs frequency v s = 5.5 v, v cm = 2.5 v, f = 1 khz, g = 1, bw = 80 khz figure 14. thd + n vs amplitude figure 15. quiescent current vs supply voltage figure 16. quiescent current vs temperature figure 17. open-loop output impedance vs frequency amplitude (v rms ) thd + n (db) 0.001 0.01 0.1 1 2 -100 -80 -60 -40 -20 0 d020 g = +1, r l = 2 k : g = +1, r l = 10 k : g = 1, r l = 2 k : g = 1, r l = 10 k : frequency (hz) open-loop output impedance ( : ) 0 200 400 600 800 1000 1200 1400 1600 1800 2000 1k 10k 100k 1m 10m d023 voltage supply (v) quiescent current ( p a) 2.5 3 3.5 4 4.5 5 5.5 60 70 80 90 100 d021 temperature ( q c) quiescent current ( p a) -40 -20 0 20 40 60 80 100 120 140 60 70 80 90 100 d022 frequency (hz) thd + n (db) -100 -90 -80 -70 -60 -50 100 1k 10k d019 rl = 2k rl = 10k frequency (hz) input voltage noise spectral density (nv/ ? hz) 0 20 40 60 80 100 120 140 10 100 1k 10k 100k d018
12 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v+ = 2.75 v, v ? = ? 2.75 v, r l = 10 k connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) g = 1, v in = 100 mvpp figure 18. small signal overshoot vs capacitive load g = ? 1, v in = 100 mvpp figure 19. small signal overshoot vs capacitive load figure 20. phase margin vs capacitive load g = 1, v in = 6.5 v pp figure 21. no phase reversal g = ? 10, v in = 600 mv pp figure 22. overload recovery g = 1, v in = 100 mv pp , c l = 10 pf figure 23. small-signal step response time (10 p s/div) voltage (20 mv/div) d029 v out v in capacitance load (pf) phase margin ( q ) 0 200 400 600 800 1000 0 10 20 30 40 50 60 70 80 90 d026 time (100 p s/div) amplitude (1 v/div) d027d027 v out v in capacitance load (pf) overshoot (%) 0 200 400 600 800 1000 0 5 10 15 20 25 30 35 40 45 50 d024 overshoot (+) overshoot (C) capacitance load (pf) overshoot (%) 0 200 400 600 800 1000 0 5 10 15 20 25 30 35 40 45 50 d025 overshoot (+) overshoot ( C) time (20 p s/div) amplitude (1 v/div) d028 v out v in
13 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated typical characteristics (continued) at t a = 25 c, v+ = 2.75 v, v ? = ? 2.75 v, r l = 10 k connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) g = 1, v in = 4 v pp , c l = 10 pf figure 24. large-signal step response g = 1, c l = 100 pf, 2-v step figure 25. large-signal settling time (negative) g = 1, c l = 100 pf, 2-v step figure 26. large-signal settling time (positive) figure 27. short-circuit current vs temperature figure 28. electromagnetic interference rejection ratio referred to noninverting input (emirr+) vs frequency figure 29. channel separation time (1 s/div) output voltage (1 mv/div) d031 frequency (hz) emirr (db) 0 20 40 60 80 100 120 140 10m 100m 1g 10g d035 time (10 p s/div) voltage (1 v/div) d030 v out v in temperature ( q c) short circuit current (ma) -40 -20 0 20 40 60 80 100 120 -80 -60 -40 -20 0 20 40 60 80 d033 sinking sourcing time (1 p s/div) output voltage (1 mv/div) d032 frequency (hz) channel separation (db) -140 -120 -100 -80 -60 -40 -20 0 1k 10k 100k 1m 10m d036
14 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 7 detailed description 7.1 overview the lm290xlv family of low-power op amps is intended for cost-optimized systems. these devices operate from 2.7 v to 5.5 v, are unity-gain stable, and are designed for a wide range of general-purpose applications. the input common-mode voltage range includes the negative rail and allows the lm290xlv family to be used in many single-supply applications. 7.2 functional block diagram 7.3 feature description 7.3.1 operating voltage the lm290xlv family of op amps is specified for operation from 2.7 v to 5.5 v. in addition, many specifications apply from ? 40 c to 125 c. parameters that vary significantly with operating voltages or temperature are shown in the electrical characteristics section. 7.3.2 common-mode input range includes ground the input common-mode voltage range of the lm290xlv family extends to the negative supply rail and within 1 v below the positive rail for the full supply voltage range of 2.7 v to 5.5 v. this performance is achieved with a p ? channel differential pair, as shown in the functional block diagram . additionally, a complementary n ? channel differential pair has been included in parallel to eliminate issues with phase reversal that are common with previous generations of op amps. however, the n-channel pair is not optimized for operation, and significant performance degradation occurs while this pair is operational. ti recommends limiting any voltage applied at the inputs to at least 1 v below the positive supply rail (v+) to ensure that the op amp conforms to the specifications detailed in the electrical characteristics table. reference current v+ v in - v in+ v (ground) - v bias2 v bias1 class ab control circuitry v o
15 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated feature description (continued) 7.3.3 overload recovery overload recovery is defined as the time required for the operational amplifier output to recover from a saturated state to a linear state. the output devices of the operational amplifier enter a saturation region when the output voltage exceeds the specified output voltage swing, because of the high input voltage or the high gain. after the device enters the saturation region, the charge carriers in the output devices require time to return to the linear state. after the charge carriers return to the linear state, the device begins to slew at the specified slew rate. therefore, the propagation delay (in case of an overload condition) is the sum of the overload recovery time and the slew time. the overload recovery time for the lm290xlv family is typically 1 s. 7.3.4 electrical overstress designers often ask questions about the capability of an operational amplifier to withstand electrical overstress. these questions tend to focus on the device inputs, but can also involve the supply voltage pins. each of these different pin functions has electrical stress limits determined by the voltage breakdown characteristics of the particular semiconductor fabrication process and specific circuits connected to the pin. additionally, internal electrostatic discharge (esd) protection is built into these circuits to protect them from accidental esd events both before and during product assembly. having a good understanding of this basic esd circuitry and its relevance to an electrical overstress event is helpful. figure 30 shows the esd circuits contained in the lm290xlv. the esd protection circuitry involves several current-steering diodes connected from the input and output pins and routed back to the internal power supply lines, where they meet at an absorption device internal to the operational amplifier. this protection circuitry is intended to remain inactive during normal circuit operation. figure 30. equivalent internal esd circuitry 7.3.5 emi susceptibility and input filtering texas instruments has developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10 mhz to 6 ghz. the figure 28 plot illustrates the performance of the lm290xlv family's emi filters across a wide range of frequencies. for more detailed information, see emi rejection ratio of operational amplifiers available for download from www.ti.com . 7.4 device functional modes the lm290xlv family has a single functional mode. the devices are powered on as long as the power-supply voltage is between 2.7 v ( 1.35 v) and 5.5 v ( 2.75 v). + v + v +in in out power supply esd cell
16 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the lm290xlv devices are a family of low-power, cost-optimized operational amplifiers. the devices operate from 2.7 v to 5.5 v, are unity-gain stable, and are suitable for a wide range of general-purpose applications. the input common-mode voltage range includes the negative rail, and allows the lm290xlv to be used in any single- supply applications. 8.2 typical application figure 31 shows the lm290xlv device configured in a low-side current sensing application. figure 31. lm290xlv device in a low-side, current-sensing application 8.2.1 design requirements the design requirements for this design are: ? load current: 0 a to 1 a ? output voltage: 3.5 v ? maximum shunt voltage: 100 mv 8.2.2 detailed design procedure the transfer function of the circuit in figure 31 is given in equation 1 : (1) the load current (i load ) produces a voltage drop across the shunt resistor (r shunt ). the load current is set from 0 a to 1 a. to keep the shunt voltage below 100 mv at maximum load current, the largest allowable shunt resistor is shown using equation 2 : (2) i load z load v bus v shunt r shunt 0.1 ? r f 255 n? r g 7.5 n? v out 5 v + + _ _ shunt max shunt load max v 100mv r 100m i 1a : out load shunt v i r gain u u
17 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated typical application (continued) using equation 2 , r shunt is calculated to be 100 m . the voltage drop produced by i load and r shunt is amplified by the lm290xlv device to produce an output voltage of approximately 0 v to 3.5 v. the gain needed by the lm290xlv to produce the necessary output voltage is calculated using equation 3 : (3) using equation 3 , the required gain is calculated to be 35 v/v, which is set with resistors r f and r g . equation 4 sizes the resistors r f and r g , to set the gain of the lm290xlv device to 35 v/v. (4) 8.2.3 application curve selecting r f as 255 k and r g as 7.5 k provides a combination that equals 35 v/v. figure 32 shows the measured transfer function of the circuit shown in figure 31 . notice that the gain is only a function of the feedback and gain resistors. this gain is adjusted by varying the ratio of the resistors and the actual resistors values are determined by the impedance levels that the designer wants to establish. the impedance level determines the current drain, the effect that stray capacitance has, and a few other behaviors. there is no optimal impedance selection that works for every system, you must choose an impedance that is ideal for your system parameters. figure 32. low-side, current-sense transfer function i load (a) output (v) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.5 1 1.5 2 2.5 3 3.5 outp _ _ _ _ out max out min in max in min v v gain v v f g r gain 1 r
18 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 9 power supply recommendations the lm290xlv family is specified for operation from 2.7 v to 5.5 v ( 1.35 v to 2.75 v); many specifications apply from ? 40 c to 125 c. the electrical characteristics section presents parameters that may exhibit significant variance with regard to operating voltage or temperature. caution supply voltages larger than 6 v may permanently damage the device; see the absolute maximum ratings table. place 0.1- f bypass capacitors close to the power-supply pins to reduce coupling errors from noisy or high- impedance power supplies. for more detailed information on bypass capacitor placement, see the layout guidelines section. 9.1 input and esd protection the lm290xlv family incorporates internal esd protection circuits on all pins. for input and output pins, this protection primarily consists of current-steering diodes connected between the input and power-supply pins. these esd protection diodes provide in-circuit, input overdrive protection, as long as the current is limited to 10 ma, as stated in the absolute maximum ratings table. figure 33 shows how a series input resistor can be added to the driven input to limit the input current. the added resistor contributes thermal noise at the amplifier input and the value must be kept to a minimum in noise-sensitive applications. figure 33. input current protection 5 k w 10-ma maximum v+ v in v out i overload device
19 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 10 layout 10.1 layout guidelines for best operational performance of the device, use good printed circuit board (pcb) layout practices, including: ? noise can propagate into analog circuitry through the power pins of the circuit as a whole and of the op amp itself. bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. ? connect low-esr, 0.1- f ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. a single bypass capacitor from v+ to ground is applicable for single- supply applications. ? separate grounding for analog and digital portions of circuitry is one of the simplest and most effective methods of noise suppression. one or more layers on multilayer pcbs are usually devoted to ground planes. a ground plane helps distribute heat and reduces electromagnetic interference (emi) noise pickup. take care to physically separate digital and analog grounds. use thermal signatures or emi measurement techniques to determine where the majority of the ground current is flowing and be sure to route this path away from sensitive analog circuitry. for more detailed information, see circuit board layout techniques . ? to reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. if these traces cannot be kept separate, crossing the sensitive trace at a 90 degree angle is much better as opposed to running the traces in parallel with the noisy trace. ? place the external components as close to the device as possible, as shown in figure 35 . keeping r f and r g close to the inverting input minimizes parasitic capacitance. ? keep the length of input traces as short as possible. remember that the input traces are the most sensitive part of the circuit. ? consider a driven, low-impedance guard ring around the critical traces. a guard ring may significantly reduce leakage currents from nearby traces that are at different potentials. ? cleaning the pcb following board assembly is recommended for best performance. ? any precision integrated circuit can experience performance shifts resulting from moisture ingress into the plastic package. following any aqueous pcb cleaning process, baking the pcb assembly is recommended to remove moisture introduced into the device packaging during the cleaning process. a low-temperature, post-cleaning bake at 85 c for 30 minutes is sufficient for most circumstances. 10.2 layout example figure 34. schematic representation for figure 35 + vin 2 vout 2 r g r f + vin 1 vout 1 r g r f
20 lm2902lv , LM2904LV sbos960 ? september 2018 www.ti.com product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated layout example (continued) figure 35. layout example out1 in1 in1 + v out2 in2 in2 + v+ v s gnd ground (gnd) plane on another layer keep input traces short and run the input traces as far away from the supply lines as possible . place components close to device and to each other to reduce parasitic errors . use low-esr, ceramic bypass capacitor . place as close to the device as possible . vin 1 gnd r f r g vin 2 gnd r f r g v s+ gnd out 1 out 2 use low-esr, ceramic bypass capacitor . place as close to the device as possible .
21 lm2902lv , LM2904LV www.ti.com sbos960 ? september 2018 product folder links: lm2902lv LM2904LV submit documentation feedback copyright ? 2018, texas instruments incorporated 11 device and documentation support 11.1 documentation support 11.1.1 related documentation for related documentation, see the following: ? texas instruments, emi rejection ratio of operational amplifiers 11.2 related links the table below lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to order now. [i re-ran the related links macro. your table had links to lm324lv and lm358lv.] table 1. related links parts product folder order now technical documents tools & software support & community lm2902lv click here click here click here click here click here LM2904LV click here click here click here click here click here 11.3 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 11.4 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.5 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 11.6 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most- current data available for the designated devices. this data is subject to change without notice and without revision of this document. for browser-based versions of this data sheet, see the left-hand navigation pane.
package option addendum www.ti.com 28-sep-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples lm2902lvidr preview soic d 14 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 lm2902lv lm2902lvipwr preview tssop pw 14 2000 green (rohs & no sb/br) cu sn level-2-260c-1 year -40 to 125 lm2902lv LM2904LVidgkr active vssop dgk 8 2500 green (rohs & no sb/br) cu nipdauag level-2-260c-1 year -40 to 125 1sqx LM2904LVidr preview soic d 8 2500 green (rohs & no sb/br) cu sn level-2-260c-1 year -40 to 125 2904lv LM2904LVipwr active tssop pw 8 2000 green (rohs & no sb/br) cu sn level-2-260c-1 year -40 to 125 2904 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width.
package option addendum www.ti.com 28-sep-2018 addendum-page 2 important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant LM2904LVidgkr vssop dgk 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 q1 LM2904LVipwr tssop pw 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 q1 package materials information www.ti.com 28-sep-2018 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) LM2904LVidgkr vssop dgk 8 2500 366.0 364.0 50.0 LM2904LVipwr tssop pw 8 2000 366.0 364.0 50.0 package materials information www.ti.com 28-sep-2018 pack materials-page 2

www.ti.com package outline c typ 6.6 6.2 1.2 max 6x 0.65 8x 0.30 0.19 2x 1.95 0.15 0.05 (0.15) typ 0 - 8 0.25 gage plane 0.75 0.50 a note 3 3.1 2.9 b note 4 4.5 4.3 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this dimension does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. this dimension does not include interlead flash. interlead flash shall not exceed 0.25 mm per side. 5. reference jedec registration mo-153, variation aa. 1 8 0.1 c a b 5 4 pin 1 id area seating plane 0.1 c see detail a detail a typical scale 2.800
www.ti.com example board layout (5.8) 0.05 max all around 0.05 min all around 8x (1.5) 8x (0.45) 6x (0.65) (r ) typ 0.05 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package symm symm land pattern example scale:10x 1 4 5 8 notes: (continued) 6. publication ipc-7351 may have alternate designs. 7. solder mask tolerances between and around signal pads can vary based on board fabrication site. metal solder mask opening non solder mask defined solder mask details not to scale solder mask opening metal under solder mask solder mask defined
www.ti.com example stencil design (5.8) 6x (0.65) 8x (0.45) 8x (1.5) (r ) typ 0.05 4221848/a 02/2015 tssop - 1.2 mm max height pw0008a small outline package notes: (continued) 8. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 9. board assembly site may have different recommendations for stencil design. symm symm 1 4 5 8 solder paste example based on 0.125 mm thick stencil scale:10x
important notice and disclaimer ti provides technical and reliability data (including datasheets), design resources (including reference designs), application or other design advice, web tools, safety information, and other resources ? as is ? and with all faults, and disclaims all warranties, express and implied, including without limitation any implied warranties of merchantability, fitness for a particular purpose or non-infringement of third party intellectual property rights. these resources are intended for skilled developers designing with ti products. you are solely responsible for (1) selecting the appropriate ti products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. these resources are subject to change without notice. ti grants you permission to use these resources only for development of an application that uses the ti products described in the resource. other reproduction and display of these resources is prohibited. no license is granted to any other ti intellectual property right or to any third party intellectual property right. ti disclaims responsibility for, and you will fully indemnify ti and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. ti ? s products are provided subject to ti ? s terms of sale ( www.ti.com/legal/termsofsale.html ) or other applicable terms available either on ti.com or provided in conjunction with such ti products. ti ? s provision of these resources does not expand or otherwise alter ti ? s applicable warranties or warranty disclaimers for ti products. mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2018, texas instruments incorporated

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